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IEEE International Workshop On Current & Defect Based Testing
(DBT2007)

October 26-27, 2007
Santa Clara Convention Center, CA, USA

http://dbt.tttc-events.org/

Held in Conjunction with International Test Conference Test Week (ITC 2007)


CALL FOR PAPERS & PARTICIPATION
Overview -- Submissions -- Additional Information -- Committees
Overview

THEME
Process Variations + Systematic Defects: Can DBT Help?

As we push deeper into nanometer technologies, systematic defects are outstretching random defects as the dominant yield limiter and are presenting unique challenges to the yield enhancement community. New methodologies are required to detect, monitor, and resolve systematic defect mechanisms at the 90nm technology node and below. As mainstream silicon manufacturing processes scale to and beyond the 65-nm node, we also find the mean and variance of process variations increasing. Fallout caused by systematic defects is obfuscated by process variations, making them more difficult to distinguish using traditional testing methods. This year's workshop is charged with determining whether defect-based test is better positioned to provide information regarding root cause, and whether such methods can help with the identification and isolation of systematic defects.

The IEEE International Workshop on Current and Defect Based Testing (DBT 2007) is aimed at addressing these issues and others related to this year’s theme “Process Variations + Systematic Defects: Can DBT Help?” Paper presentations on topics related to the workshop’s theme and to those given below are expected to generate active discussion on the challenges that must be met to ensure high IC quality through the end of the decade.

The workshop includes (but is not limited to) the following topics:

  • Test Data Analysis
  • Transition and Delay Testing
  • IDDQ and IDDT Testing
  • Low voltage Testing
  • Noise and Cross-talk Testing
  • Defect Coverage & Metrics
  • Economics of Defect Based Testing
  • Data-Mining approaches for Test Data Processing
  • Elevated Voltage Testing and Stress Testing
  • Reliability and Yield
  • Nanometer Test Challenges
  • Mixed Current/Voltage Testing
  • Fault Localization & Diagnosis
  • Data-Based Testing

Submissions

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To present at the workshop, submit a postscript or Acrobat (PDF) version of an extended abstract of at least 1000 words via E-mail to the Program Chair by Aug. 18, 2007. Each submission should include full name and address of each author, affiliation, telephone number, FAX and E-mail address. The presenter should also be identified. Camera-ready papers for inclusion in the digest of papers will be due on Oct. 6, 2007. Presentations on cutting edge test technology, innovative test ideas, and industrial practices and experience are welcome. Proposals for Embedded Tutorials, Debates, Panel Discussions or “Spot-Light” presentations describing industrial experiences are also invited.

Submission deadline: August 18, 2007
Acceptance Notification: September 15, 2007
Camera Ready: October 6 , 2007

Technical Program Submission:

Mohammad Tehranipoor
Program Chair
Electrical & Computer Engineering
University of Connecticut
Storrs, CT-06269, USA
Tel: (860) 486-3471, x-2447(FAX)
E-mail: tehrani@engr.uconn.edu

Additional Information
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General Information

Hans Manhaeve
General Chair
Q-Star Test
L.Bauwensstraat 20
Bruegge, Belgium
Tel: +32 50 319273. +32 50 312350(FAX)
E-mail: Hans.Manhaeve@qstar.be

Committees
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Co-General Chair

Mehdi Tahoori
Northeastern University, USA

Vice General Chair

Sankaran Menon
Intel Corporation, USA

Program Chair

Mohammad Tehranipoor
Univ. of Connecticut, USA

Vice-Program Chair

Jim Plusquellic
Univ. of Maryland, Baltimore County, USA

Finance Chair

Sankaran M. Menon
Intel Corporation, USA

Publicity Chair

Jaume Segura
UIB Baleares, Spain

Advisor

Charles Hawkins
University of New Mexico, USA

Steering Committee

Yashwant K. Malaiya (Chair), Colorado State University, USA
Anura Jayasumana C ol State Univ, USA
Joan Figueras, UPC, Barcelona, Spain
Adit Singh, Auburn University, USA
Duncan (Hank) Walker, Texas A&M Univ.

Program Committee

Robert Aitken, ARM, USA
Subhasish Mitra, Stanford Univ., USA
Chintan Patel, UMBC, USA
Jerry Soden, Sandia National Labs, USA
Michel Renovell, LIRMM, France
Krish Chakrabarty, Duke Univ., USA
Claude Thibeault,Ecole de Tech Sup,Canada
Sreejit Chakravarty, LSI Logic, USA
Martin Margala, U-Mass, USA
Sule Ozev, Duke University
Xiaoqing Wen (Kyushu Institute of Technology)
Shawn Blanton, CMU, USA
Anuja Sehgal, AMD
Sagar Sabade, Qualcomm
Nilanjan Mukherjee, Mentor Graphics
Robert Daasch, Portland State Univ.
Rajesh Raina, Freescale, USA
Geir Eide, Magma, USA
Manoj Sachdev, Univ. of Waterloo, Canada
Anne Gattiker, IBM, USA
Tom Bartenstein, Cadence, USA

For more information, visit us on the web at: http://dbt.tttc-events.org/

IEEE International Workshop On Current & Defect Based Testing is sponsored by the IEEE Computer Society TC on Test Technology.


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

SENIOR PAST CHAIR
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TTTC 2ND VICE CHAIR
Joan FIGUERAS
Universitat Politècnica de Catalunya - Spain
Tel. +34-93-401-6603
E-mail figueras@eel.upc.es

FINANCE
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

DESIGN & TEST MAGAZINE
Tim CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG

Lucent Technologies
- USA
Tel. +1-732-949-5539
E-mail chenhuan@lucent.com

TECHNICAL ACTIVITIES
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

ASIA & SOUTH PACIFIC
Hideo FUJIWARA
Nara Institute of Science and Technology - Japan
Tel. +81-74-372-5220
E-mail fujiwara@is.aist-nara.ac.jp

LATIN AMERICA
Marcelo LUBASZEWSKI
Federal University of Rio Grande do Sul - Brazil
Tel. +34-93-401-6603
E-mail luba@vortex.ufrgs.br

NORTH AMERICA
William R. MANN
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

 

PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 1ST VICE CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

INTERNATIONAL TEST CONFERENCE
Jill E. SIBERT
Raspberry Comm.
- USA
Tel. +1-484-894-1111
E-mail jill_sibert@raspberrycom.com

TEST WEEK COORDINATION
Yervant ZORIAN
Virage Logic - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
- USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it


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